The approach of the information
society has resulted in a tremendous increase in the
volume of wireless communication often giving rise
to bottle-necks in the communication systems. To
alleviate this congestion there is pressure to widen
the allocated frequency bands up to millimetre
wavelengths and to have terminals that are able to
support many standards. It is understood that
conventional components and solutions have
limitations that will make it difficult to fulfil
these requirements. The last five years has seen the
emergence of a technology, RF and microwave
MicroElectroMechanical Systems (MEMS) that seeks to
overcome these limitations. In this new technology
mechanical and electrical functions are combined to
improve the performance of existing devices, allow
on-wafer device integration and the creation of
completely new device systems called Advanced MEMS
for RF and Millimeterwave Communications "AMICOM". A
consortium has been assembled that believes the
merging MEMS technologies with 1C technologies will
lead to advanced microsystems that can operate over
very broad-band frequency ranges. The microsystems
will feature innovative functionalities, such as
circuit redundancy, reconfigurability and power
management. To realise this microsystem concept,
research and collaboration in many different fields
is required including: fabrication technology,
materials, electromagnetics, mechanics, thermal and
electrical modelling, characterisation, packaging
and reliability. We believe that a Network of
Excellence is the most appropriate vehicle with
which to assemble and integrate the isolated
competences that exist around Europe in this field.
In this way a powerful research body will be created
that can compete with the United States and Japan.
The idea is to give to the industrial partners
access to a large and transparent body of European
competence to help them to enhance their
competitiveness.
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Participant Organization:
UNIVERSITA DEGLI STUDI DI PERUGIA |
Country: ITALY |
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Participant Organization:
TECHNICAL RESEARCH CENTRE OF FINLAND |
Country: FINLAND |
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Participant Organization:
TECHNISCHE UNIVERSITAET MUENCHEN |
Country: GERMANY |
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Participant Organization:
ISTITUTO TRENTINO DI CULTURA |
Country: ITALY |
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Participant Organization:
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER
ANGEWANDTEN FORSCHUNG E.V. |
Country: GERMANY |
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Participant Organization:
IMPERIAL COLLEGE OF SCIENCE, TECHNOLOGY AND
MEDICINE |
Country: UNITED KINGDOM |
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Participant Organization:
TECHNISCHE UNIVERSITEIT DELFT |
Country: NETHERLANDS |
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Participant Organization:
INSTITUTUL NATIONAL DE CERCETARE DEZVOLTARE
PENTRU MICROTEHNOLOGIE |
Country: ROMANIA |
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Participant Organization:
UPPSALA UNIVERSITET |
Country: SWEDEN |
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Participant Organization:
ASSOCIATION POUR LA RECHERCHE ET LE
DEVELOPPEMENT DES METHODES ET PROCESSUS
INDUSTRIELS |
Country: FRANCE |
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Participant Organization:
CHALMERS TEKNISKA HOEGSKOLA AKTIEBOLAG |
Country: SWEDEN |
|
Participant Organization:
NATIONAL AND KAPODISTRIAN UNIVERSITY OF
ATHENS |
Country: GREECE |
|
Participant Organization:
FOUNDATION FOR RESEARCH AND TECHNOLOGY -
HELLAS |
Country: GREECE |
|
Participant Organization:
TECHNOLOGICAL EDUCATIONAL INSTITUTE OF CRETE |
Country: GREECE |
|
Participant Organization:
MIDDLE EAST TECHNICAL UNIVERSITY |
Country: TURKEY |
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Participant Organization:
CRANFIELD UNIVERSITY |
Country: UNITED KINGDOM |
|
Participant Organization:
INSTYTUT TECHNOLOGII MATERIALOW
ELEKTRONICZNYCH |
Country: POLAND |
|
Participant Organization:
KATHOLIEKE UNIVERSITEIT LEUVEN |
Country: BELGIUM |
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Participant Organization:
UNIVERSITAET ULM |
Country: GERMANY |
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Participant Organization:
TECHNION - ISRAEL INSTITUTE OF TECHNOLOGY |
Country: ISRAEL |
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Participant Organization:
ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE |
Country: SWITZERLAND |
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Participant Organization:
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
VZW |
Country: BELGIUM |
|
Participant Organization:
TECHNISCHE UNIVERSITAET DARMSTADT |
Country: GERMANY |
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Participant Organization:
COMMISSARIAT A L'ENERGIE ATOMIQUE |
Country: FRANCE |