Reportage

The "reportage" page contains reports and presentations from NEXUS meetings and other microsystems and nanotechnology events that could be of interest to the NEXUS community.


2007 3 1st MINOS/NEXUS FP7 Brokerage 22/23 March

24-0 Nexus Presentation 

24-1 EC Cooperation in Industry Presentation 

24-2 EC Micro & Nano-systems Presentation 

24-3 SmartHEALTH Presentation 

24-4 Colibrys Presentation 


2007_1 NEXUS MWG DMS workshop

25-0 Agenda NEXUS MWG Design Modelling Simulation workshop, 25 Jan 07, Berlin, Germany 

25-1 Introduction and PATENT results, Andrew Richardson, Lancaster University, UK 

25-2 Presentation SchroepferG Design and Virtual Manufacture 

25-3 Towards an Integrated Design approach for Si+NonSi MEMS Methodology, Markus Dickerhof, FZ Karlsruhe, Germany 

25-4 Reliability assessment of brittle MEMS structures, Matthias Ebert, Fraunhofer IWMH, Germany 

25-5 Concept for the commercialisation of Design Services in the framwork of the TechNet Alliance, Wolfgang Brose, CADFEM 

25-6 Europractice Service Clusters - Opportunities for the new Projects in FP7, Patric Salomon, 4M2C, Germany 


2006_11 NEXUS AGM and MWG Workshops, Nov 06

27-0 Agenda NEXUS AGM and MWG workshops 

27-1 Introduction by Patric Salomon, 4M2C, Germany 

27-2 Reliability issues in MEMS: physics of failure and design for reliability, Ingrid De Wolf, IMEC, Belgium 

27-3 MEMUNITY introduction: MEMS Test Challenges on wafer level, Frank-Michael Werner und Jens Klattenhoff 

27-4 PATENT-DfMM tutorial: Damping effects in MEMS, Attilio Frangi, POLIMI, Italy 

28-1 Introduction to NEXUS MWG Reliability and Test, Andrew Richardson, Lancaster University, UK 

28-2 Reliability challenges for MEMS integration, Benedetto Vigna, ST Microelectronics, Italy 

28-3 Reliability Flagship project in NoE PATENT-DfMM, Ingrid De Wolf, IMEC 

28-4 MEMS Reliability challenges in EURELNET, Yves Ousten, IXL, France 

28-5 Caneus pilot project RELIABILITY output and future business model, Philippe Perdue, CNES, France 

28-6 Parameter identification of pressure sensors at wafer level, Steffen Michael, Melexis, Germany 

28-7 MEMS test challenges: applications, solutions and future visions, MEMUNITY 

28-8 Focus Groups 

29-1 Overview Status of FP7 Call 1 and 2, Isabel Vergara, European Commission, Belgium 

29-2 NEXUS activities for Eastern organisations integration, Carmen Moldovan, IMT, Bucharest 

29-3 MNT Roadmaps, Patric Salomon, 4M2C, Germany 

29-4 Round table discussions: work group on BWG topics 

29-5 Round table discussions: work group on MWG topics 


Other Presentations and Documents