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MEMS Packaging
Welcome to the USC MEMS Packaging !
Downloadable Files for members of this USC
The User –Supplier Club MEMS Packaging met for its first meeting in April 2002, at FhG IZM in Munich. To understand challenges and issues at the very concern of MEMS packaging companies, users have been favorite at this meeting.
In total 12 participants from 14 User organizations participated: Colibrys, Epcos, FhG IZM, IMEC, Memscap, Motorola, Siemens, Saab Microtec, Thales, WTC; Philips (excused), Infineon (excused), PHS MEMS (excused)
The USC MEMS Packaging provides a plate-form for market driven technology exchange. To assure market orientation we interviewed user companies about their interests and needs in MEMS packaging.
As a result we defined three topics of priority interest
Wafer level packaging will be the topic for the next meeting which will be held in Grenoble on June 28th 2002 at PHS MEMS. During this meeting the USC starts discussion of present difficulties and existing solutions. Suppliers do interact and the evolution of new solutions begins.
Suppliers of technology, equipment and material, able to present solutions are welcome. Please contact us now!
The USC MEMS Packaging handles packaging as a transversal topic, however packaging is company specific and application oriented. It is foreseen to have application oriented sessions, dedicated for instance to packaging of RF-MEMS, Sensors and optical components. A joint meeting with other USCs e.g. Telecom will be organized as soon as input from application is wanted.
Standards are not a prime issue in this USC. The USC cooperates with the SEMI Interest Group on MEMS Standards, where several members of the USC participate. SEMI provides a top-down approach of existing standards, which is very useful for MEMS Packaging. If questions about standards raise from bottom up research, we may handle them together.
Last but not least, the members of the USC are willing to play an active role to provide excellence in MEMS packaging in Europe. Topics of joint research as well as partners and competence for R&D projects are defined. Proposals of joint projects are welcome.
Interested? Speak to us.
Meeting Minutes
Minutes of the Meetings of this USC can be found here
Contact
Henning Wicht / Carsten Bahle, USC MEMS Packaging Co-ordinators
WTC - Wicht Technical Consulting
Phone: +49 89 9280 437
E-mail: carsten.bahle@wtc-consult.de